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The problem of weather resistance and adhesion of silica gel has caused a lot of trouble for customers, and the overall comprehensive performance is naturally not comparable to epoxy resin. Epoxy resin gives everyone the impression that it is only used for in-line insertion and not for patching power. The full range of nearly 20 models of modified epoxy resin that we bring this time hopes to change everyone's inherent thinking. Li Benjie, general manager of Lianlang New Materials, said that Lianlang hopes to set off an epoxy resin counterattack in the field of LED packaging. According to experts, the six silicon-modified epoxy adhesives promoted by Lianlang new materials provide customers with leading solutions for LED packaging. At present, there are two main technical development directions for glue. One is from silica gel to epoxy modification, and the other is Li Benjie's lead from Epoxy to silicon modification. He believes that the problem of weather resistance and adhesion of silica gel has caused a lot of trouble for customers, and the overall performance is naturally not comparable to epoxy resin. The six silicon-modified epoxy adhesives promoted by Lianlang's new materials provide customers with industry-leading solutions for LED packaging.
According to experts, the first paragraph is the revolutionary 15-minute one-time rapid curing of Lianlang new materials. The innovative white LED 9485 for lighting packaging covers a full range of small, medium and high powers in the chip package. After 356 reflow after 5630 package Solder, test 2500 hours of zero light decay. The second paragraph is for outdoor display, through the highest MSL1 (double 85 over 168 hours) certified high water resistance, heat and cold resistance 5189. The third paragraph is used for traditional lighting package, power in 1W level, 2000 hours zero Light faded white glue 5388. The fourth paragraph is the thermal conductivity of 4.0, the general market can only reach 1.2 of the solid crystal glue 4288. The fifth paragraph is for the 60W and below the level of COB potting glue 9288, the glue is currently Over-stress test, I believe that the best quality can be achieved during the exhibition. The sixth paragraph is 6188 for packaging UV devices. The current production of UV packaged lamps is relatively small but the profit is very good. Few companies around the world can produce package glue for UV wicks. The current performance of this glue has been Fully surpassing Japanese manufacturers, it is very worthwhile for customers to boldly replace imports.
Our silicon-modified alicyclic epoxy resin encapsulant can completely solve the defects that traditional epoxy resin materials can not be used for medium and high power, and has successfully solved the problems of high temperature resistance, easy embrittlement and cracking, etc. The unique technology is to radiate heat quickly, instead of stupidly resisting high temperatures, so it will surpass the silica gel to achieve medium and high power zero light decay. Li Benjie is confident in the quality of the products developed by Lianlang New Materials over three years. In addition, Li Benjie hopes to find a partner who uses silicon-modified epoxy resin raw materials through this exhibition, and hopes to cooperate with the packaging leader enterprise to develop a one-time rapid curing encapsulation process, such as Lianlang has a mature ten-second UV curing. SMD white glue technology, but it is difficult to do comprehensive testing and large-area promotion and application without the supporting packaging technology. However, this technology is extremely valuable for solving the headaches of packaging customers, such as large inventory, complicated process and high rework rate. Said the cost advantage of energy saving. We hope to find like-minded people and push the epoxy resin against the silica gel. Li Benjie said.